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Optical Chiplet Interconnect Promises to Accelerate Demanding Computing Applications
- 2024/09/17
- 再生時間: 20 分
- ポッドキャスト
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サマリー
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あらすじ・解説
The growth in high-performance computing and AI in advanced chip architectures is creating issues when it comes to intra-chip data management, especially as they migrate to chiplet-based topologies. Addressing this chip-level issue, Avicena announced its scalable LightBundle chiplet interconnect solution, offering ultra-high density die-to-die connections with a multi-Tbps/mm shoreline bandwidth density at sub-pJ/bit energy efficiency. In this podcast we talk to Bardia Pezeshki, Founder and CEO of Avicena, about the issues of intra-chip data management and his company’s solution.